EP2AGZ300FH29I4N vs EP2AGZ300FH29I4G Comparison
Detailed side-by-side comparison of EP2AGZ300FH29I4N by Intel and EP2AGZ300FH29I4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300FH29I4N | EP2AGZ300FH29I4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,380.00 | $1,350.00 |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements | 298,000 | β |
| Logic Array Blocks (LABs) | 11,920 | β |
| Embedded Memory Bits | 18,854,912 | β |
| User I/Os | 281 | β |
| Operating Frequency (max) | 500 MHz | β |
| Process Technology | 40 nm CMOS | β |
| Core Supply Voltage | 0.9 V | β |
| Package | 780-ball FCBGA (FH29) | β |
| Package Code | BGA / FC-HFBGA | FH29 (29x29 mm) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I4 speed/temperature grade) | β |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | Yes (per RoHS) |
| Number of Cells | 298,000 | β |
| Logic Elements (LE) | β | 300,000 (approx., per family member) |
| Number of I/O | β | 281 |
| Package Type | β | 780-ball Flip-Chip BGA (FineLine) |
| Operating Temperature Range | β | -40C to +100C (industrial, I-grade) |
| Speed Grade | β | I4 |
| Process Node | β | 40 nm TSMC |
| Supply Voltage (Core) | β | 0.9 V (typical) |
| Configuration Method | β | JTAG / Passive Serial / Fast Passive Parallel |
| Transceivers | β | Embedded multi-gigabit transceivers (per family) |
| DSP Blocks | β | Yes (variable-precision, per family) |
| Block RAM | β | Embedded M9K / M144K blocks |
| MSL Level | β | [DATA_NEEDED: MSL rating] |