EP2C8F256I8N vs EP2C8AF256I8N Comparison
Detailed side-by-side comparison of EP2C8F256I8N by Intel and EP2C8AF256I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2C8F256I8N | EP2C8AF256I8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.95 | $21.40 |
| Series | Cyclone II | β |
| Logic Elements (LEs) | 8,256 | β |
| Embedded Memory Bits | 165,888 bits | 165,888 bits (162 Kbit RAM) |
| Total RAM Bits | 165,888 | β |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | β |
| User I/O Pins | 182 | β |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | β |
| Embedded 18x18 Multipliers | Up to 36 | β |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | β |
| Core Supply Voltage | 1.2 V | β |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | β |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS, SRAM-based |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | β |
| Operating Temperature | -40C to +85C (industrial) | -40C to +100C (Industrial, I suffix) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | β |
| RoHS Status | Compliant (Pb-free, lead-free reflow compatible) | Lead-free (per Altera ordering code suffix) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | β | Cyclone II |
| Logic Elements (LE) | β | 8,256 |
| Embedded Multipliers (18x18) | β | 36 |
| Maximum User I/O Pins | β | 182 |
| Global Clocks | β | 16 |
| Configuration Elements | β | Embedded SRAM, JTAG, AS, PS |
| Core Voltage (VCCINT) | β | 1.2 V |
| I/O Voltage (VCCIO) | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) |
| Package | β | 256-ball FBGA (FineLine BGA) |
| Speed Grade | β | 8 |
| Status Suffix | β | N (lead-free, Pb-free) |