EP2C8F256I8N vs EP2C8AF256I8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C8F256I8N disebabkan oleh Intel dan EP2C8AF256I8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2C8F256I8N | EP2C8AF256I8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Harga Unit (USD) | — | $21.40 |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | 165,888 bits (162 Kbit RAM) |
| Total RAM Bits | 165,888 | — |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS, SRAM-based |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Suhu Operasi | -40C to +85C (industrial) | -40C to +100C (Industrial, I suffix) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Status RoHS | Compliant (Pb-free, lead-free reflow compatible) | Lead-free (per Altera ordering code suffix) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone II |
| Logic Elements (LE) | — | 8,256 |
| Embedded Multipliers (18x18) | — | 36 |
| Maximum User I/O Pins | — | 182 |
| Global Clocks | — | 16 |
| Configuration Elements | — | Embedded SRAM, JTAG, AS, PS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) |
| Kemasan | — | 256-ball FBGA (FineLine BGA) |
| Speed Grade | — | 8 |
| Status Suffix | — | N (lead-free, Pb-free) |