EP2SGX30DF780C5 vs EP2SGX30DF780C4 Comparison
Detailed side-by-side comparison of EP2SGX30DF780C5 by Intel and EP2SGX30DF780C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX30DF780C5 | EP2SGX30DF780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | End of Life |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 33,880 | — |
| LABs/CLBs | 1694 | — |
| Total RAM Bits | 1,369,728 bits | — |
| Number of Logic Cells | 33,880 cells | — |
| Maximum User I/Os | 361 | — |
| Transceiver Channels | 4 (up to 3.125 Gbps each) | — |
| Internal Frequency (max) | 609.76 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Temperature | -40C to +85C (commercial) | — |
| Package | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) |
| Mounting Type | Surface Mount | Surface Mount |
| Speed Grade | -5 | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status from verified data] | Compliant (per manufacturer product page) |
| Logic Elements | — | 33,880 |
| Logic Cells | — | 33,880 |
| Number of LABs / CLBs | — | 1,694 |
| Total Number of I/Os | — | 361 |
| Maximum Operating Frequency | — | 717 MHz |
| Number of Transceivers | — | 20 (embedded multi-gigabit) |
| Operating Temperature Grade | — | Commercial (C4) |
| Programmable Terminals | — | BGA ball grid (780 terminals) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| MSL Level | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | Yes |