EP2SGX30DF780C5 vs EP2SGX30DF780C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780C5 sa pamamagitan ng Intel at EP2SGX30DF780C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel
EP2SGX30DF780C4 ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | EP2SGX30DF780C5 | EP2SGX30DF780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Tapus ng Buhay |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 33,880 | — |
| LABs/CLBs | 1694 | — |
| Total RAM Bits | 1,369,728 bits | — |
| Number of Logic Cells | 33,880 cells | — |
| Maximum User I/Os | 361 | — |
| Transceiver Channels | 4 (up to 3.125 Gbps each) | — |
| Internal Frequency (max) | 609.76 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | -40C to +85C (commercial) | — |
| Packhaging | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | -5 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status from verified data] | Compliant (per manufacturer product page) |
| Logic Elements | — | 33,880 |
| Logic Cells | — | 33,880 |
| Number of LABs / CLBs | — | 1,694 |
| Total Number of I/Os | — | 361 |
| Maximum Operating Frequency | — | 717 MHz |
| Number of Transceivers | — | 20 (embedded multi-gigabit) |
| Operating Temperature Grade | — | Commercial (C4) |
| Programmable Terminals | — | BGA ball grid (780 terminals) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | Yes |