EP2SGX60EF1152I4 vs EP2SGX60EF1152I3N Comparison

Detailed side-by-side comparison of EP2SGX60EF1152I4 by Intel and EP2SGX60EF1152I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60EF1152I4 EP2SGX60EF1152I3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $1,195.00
Device Family Stratix II GX β€”
Logic Elements 60,440 β€”
Logic Cells 60,440 β€”
Logic Array Blocks (LABs) 3,022 β€”
Embedded Memory 2,544,192 bits β€”
User I/O Pins 534 β€”
Maximum Internal Frequency 717 MHz (per data source) β€”
Maximum Operating Frequency 732.1 MHz (per data source) β€”
Process Technology 90 nm CMOS 90 nm
Core Supply Voltage 1.2 V β€”
Package 1152-ball FC-FBGA (flip-chip fine-pitch BGA) β€”
Package Dimensions 23 x 23 mm, 1 mm pitch (per data source) β€”
Temperature Grade Industrial Industrial (-40C to +100C junction)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Family β€” Stratix II GX
Device Type β€” Field-Programmable Gate Array (FPGA)
Logic Elements (LEs) β€” 60,440
Configurable Logic Blocks (CLBs) β€” 60,440
Embedded Memory Bits β€” 2,544,192 bits
Internal Frequency (max) β€” 717 MHz
Core Voltage β€” 1.2 V
Package Type β€” 1152-ball FC-FBGA
Package Size β€” 35 x 35 mm (1 mm ball pitch)
Number of Terminals β€” 1152
Terminal Form β€” Ball
Lead-Free β€” Yes
MSL Level β€” [DATA_NEEDED: MSL level]

Datasheets & Resources

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