EP2SGX60EF1152I4 vs EP2SGX60EF1152I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152I4 disebabkan oleh Intel dan EP2SGX60EF1152I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX60EF1152I4 | EP2SGX60EF1152I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Logic Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Embedded Memory | 2,544,192 bits | — |
| User I/O Pins | 534 | — |
| Maximum Internal Frequency | 717 MHz (per data source) | — |
| Maximum Operating Frequency | 732.1 MHz (per data source) | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Kemasan | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) | — |
| Package Dimensions | 23 x 23 mm, 1 mm pitch (per data source) | — |
| Temperature Grade | Industrial | Industrial (-40C to +100C junction) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Family | — | Stratix II GX |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL level] |