EP2SGX60EF1152I4 vs EP2SGX60EF1152I3N Comparación
Comparación detallada lado a lado de EP2SGX60EF1152I4 por Intel y EP2SGX60EF1152I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60EF1152I4 | EP2SGX60EF1152I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $1.195,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Logic Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Embedded Memory | 2,544,192 bits | — |
| User I/O Pins | 534 | — |
| Maximum Internal Frequency | 717 MHz (per data source) | — |
| Maximum Operating Frequency | 732.1 MHz (per data source) | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Encapsulado | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) | — |
| Package Dimensions | 23 x 23 mm, 1 mm pitch (per data source) | — |
| Temperature Grade | Industrial | Industrial (-40C to +100C junction) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Family | — | Stratix II GX |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |