EP2SGX90EF1152C3ES vs EP2SGX90EF1152C3 Comparison

Detailed side-by-side comparison of EP2SGX90EF1152C3ES by Intel and EP2SGX90EF1152C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX90EF1152C3ES EP2SGX90EF1152C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy NRND
Family Stratix II GX —
Process Node 90 nm —
Logic Elements 90,960 —
Embedded Memory 4,520,448 bits (approx. 4.5 Mbit) —
User I/O Pins 558 —
Package 1152-BBGA (FineLine BGA, 35x35 mm) 1152-FBGA (FineLine BGA)
Speed Grade C3 C3
Temperature Grade Commercial Extended (-40 C to +100 C) —
Core Voltage 1.5 V (Enhanced, 'E' suffix) —
High-Speed Transceivers Up to 12 channels (per Stratix II GX family) —
Transceiver Data Rate Up to 6.375 Gbps per channel (family spec) 3.125 - 6.375 Gbps
DSP Blocks Yes, dedicated 18x18 multipliers and accumulators —
PLL Count [DATA_NEEDED: PLL count for EP2SGX90 variant] —
User I/O Banks 24 (per package datasheet) —
Configuration SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Yes —
Series — Stratix II GX
Logic Elements (LEs) — 90,960
Total RAM Bits — 4,520,448 (4.5 Mbit)
User I/O Count — 558
Number of LABs/CLBs — 4548
Number of Transceivers — 12
Number of PLLs — 4
DSP Blocks (18x18 multipliers) — 384
Core Voltage (VCCINT) — 1.2 V
Process Technology — 90 nm CMOS
Operating Temperature — 0C to +85C (commercial)

Datasheets & Resources

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