EP2SGX90EF1152C3N vs EP2SGX90EF1152C4N Comparison
Detailed side-by-side comparison of EP2SGX90EF1152C3N by Intel and EP2SGX90EF1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N β Last Time BuySpecification Comparison
| Parameter | EP2SGX90EF1152C3N | EP2SGX90EF1152C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,280.00 | $695.00 |
| Series | Stratix II GX | β |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | 90,960 |
| Number of LABs/CLBs | 4548 | β |
| Total Memory Bits | 4520448 | β |
| User I/Os | 558 | β |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | β |
| Process Technology | 90 nm | β |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Frequency (max) | 816.9 MHz | β |
| Operating Temperature | 0C to +85C (Commercial) | Commercial (0C to +85C) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | β |
| Package Pin Count | 1152 balls | β |
| Package Dimensions | 34 mm x 34 mm | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | Lead free; RoHS compliance per JEDEC |
| Speed Grade | EF | C4 |
| Temperature Grade | C3 (Commercial) | β |
| LABs/CLBs | β | 4,548 |
| Total RAM Bits | β | 4,520,448 bits |
| User I/O Count | β | 558 |
| Number of I/O Banks | β | [DATA_NEEDED: number of I/O banks] |
| Process Node | β | 90 nm |
| Transceivers | β | Up to 20 channels, 6.375 Gbps per channel |
| Package | β | 1152-BBGA / FC-FBGA-1152 |
| MSL Level | β | MSL-3 / MS-034AAR-1 (per package outline) |