EP2SGX90EF1152C3N vs EP2SGX90EF1152C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C3N disebabkan oleh Intel dan EP2SGX90EF1152C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX90EF1152C3N | EP2SGX90EF1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | 90,960 |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Frequency (max) | 816.9 MHz | — |
| Suhu Operasi | 0C to +85C (Commercial) | Commercial (0C to +85C) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | Lead free; RoHS compliance per JEDEC |
| Speed Grade | EF | C4 |
| Temperature Grade | C3 (Commercial) | — |
| LABs/CLBs | — | 4,548 |
| Total RAM Bits | — | 4,520,448 bits |
| User I/O Count | — | 558 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Process Node | — | 90 nm |
| Transceivers | — | Up to 20 channels, 6.375 Gbps per channel |
| Kemasan | — | 1152-BBGA / FC-FBGA-1152 |
| Aras MSL | — | MSL-3 / MS-034AAR-1 (per package outline) |