EP3C16E144C8N vs EP3C16E144I7 Comparison
Detailed side-by-side comparison of EP3C16E144C8N by Intel and EP3C16E144I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C16E144C8N | EP3C16E144I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 15,408 | — |
| Total Memory Bits | 516,096 bits (63 Kbytes) | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins | 84 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad |
| Speed Grade | C8 | — |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration Memory | SRAM-based (volatile) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Cells | — | 15,408 |
| I/O Count | — | 84 |
| Package Code | — | LFQFP |
| Package Body Size | — | 20 x 20 mm |
| Package Pitch | — | 0.40 mm |
| Pin Count | — | 144 |
| Terminal Type | — | Gull wing |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Embedded Memory | — | [DATA_NEEDED: embedded memory specification] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |