EP3C16E144C8N vs EP3C16E144I7 Vergleich
Detaillierter Direktvergleich von EP3C16E144C8N von Intel und EP3C16E144I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16E144C8N | EP3C16E144I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 15,408 | — |
| Total Memory Bits | 516,096 bits (63 Kbytes) | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins | 84 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad |
| Speed Grade | C8 | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration Memory | SRAM-based (volatile) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Cells | — | 15,408 |
| I/O Count | — | 84 |
| Package Code | — | LFQFP |
| Package Body Size | — | 20 x 20 mm |
| Package Pitch | — | 0.40 mm |
| Pin-Anzahl | — | 144 |
| Terminal Type | — | Gull wing |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Embedded Memory | — | [DATA_NEEDED: embedded memory specification] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |