EP3C16E144C8N vs EP3C16E144I7 Comparación
Comparación detallada lado a lado de EP3C16E144C8N por Intel y EP3C16E144I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16E144C8N | EP3C16E144I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 15,408 | — |
| Total Memory Bits | 516,096 bits (63 Kbytes) | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins | 84 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad |
| Speed Grade | C8 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration Memory | SRAM-based (volatile) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Cells | — | 15,408 |
| I/O Count | — | 84 |
| Package Code | — | LFQFP |
| Package Body Size | — | 20 x 20 mm |
| Package Pitch | — | 0.40 mm |
| Recuento de pines | — | 144 |
| Terminal Type | — | Gull wing |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Embedded Memory | — | [DATA_NEEDED: embedded memory specification] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |