EP3C16F256I7N vs EP3C16U256C7 Comparison

Detailed side-by-side comparison of EP3C16F256I7N by Intel and EP3C16U256C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F256I7N EP3C16U256C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) —
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
Package 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) 256-LFBGA
Operating Temperature -40C to +100C (industrial, I7) —
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage —
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant [DATA_NEEDED: RoHS compliance]
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Elements — 15,408
Embedded RAM — 516,096 bits
User I/O Count — 168
Technology — 65 nm
Core Supply Voltage — 1.2 V
Maximum Clock Frequency — 437.5 MHz
Manufacturer — Intel/Altera
Series — Cyclone III
Mounting Type — Surface Mount
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
I/O Standard Options — [DATA_NEEDED: supported I/O standards]
Number of PLLs — [DATA_NEEDED: PLL count]
Configuration Scheme — [DATA_NEEDED: supported configuration schemes]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Automotive Qualification — [DATA_NEEDED: AEC-Q100 qualification]

Datasheets & Resources

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