EP3C16F484C6N vs EP3C16F484C7 Comparison

Detailed side-by-side comparison of EP3C16F484C6N by Intel and EP3C16F484C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F484C6N EP3C16F484C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Cyclone III —
Family Cyclone III —
Logic Elements (LE) 15,408 —
Adaptive Logic Modules (ALMs) 963 ALMs —
Embedded Memory 516,096 bits (504 Kbits) [DATA_NEEDED: embedded memory capacity]
Embedded 18x18 Multipliers 56 —
User I/O Pins (max) 346 —
PLLs 4 —
Global Clock Networks 20 —
Core Supply Voltage 1.15 V to 1.25 V 1.2 V
Operating Temperature (Commercial) 0 C to 85 C —
Speed Grade -6 —
Package 484-ball FineLine BGA (FBGA) —
Ball Pitch 1.0 mm —
Process Technology 65 nm TSMC 65 nm CMOS
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel —
Mounting Type Surface Mount Surface mount
RoHS Status Compliant (lead-free, N suffix) unknown
Device Type — FPGA
FPGA Family — Cyclone III
Logic Elements — 15,408 elements
Logic Array Blocks — 963 LABs
Maximum Frequency — 437.5 MHz
Number of I/Os — 346 I/Os
Package Type — 484-pin FBGA
Number of Pins — 484 pins
Programmability — User-programmable FPGA
I/O Type — [DATA_NEEDED: supported I/O standards]
PLL Count — [DATA_NEEDED: PLL count]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
REACH Status — unknown
AEC-Q100 Qualification — not_applicable
Standard Package Quantity — [DATA_NEEDED: standard package quantity]

Datasheets & Resources

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