EP3C16F484C6N vs EP3C16F484C7 Comparación
Comparación detallada lado a lado de EP3C16F484C6N por Intel y EP3C16F484C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F484C6N | EP3C16F484C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Series | Cyclone III | — |
| Family | Cyclone III | — |
| Logic Elements (LE) | 15,408 | — |
| Adaptive Logic Modules (ALMs) | 963 ALMs | — |
| Embedded Memory | 516,096 bits (504 Kbits) | [DATA_NEEDED: embedded memory capacity] |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins (max) | 346 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| Operating Temperature (Commercial) | 0 C to 85 C | — |
| Speed Grade | -6 | — |
| Encapsulado | 484-ball FineLine BGA (FBGA) | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 65 nm TSMC | 65 nm CMOS |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Tipo de montaje | Surface Mount | Surface mount |
| Estado RoHS | Compliant (lead-free, N suffix) | unknown |
| Device Type | — | FPGA |
| FPGA Family | — | Cyclone III |
| Logic Elements | — | 15,408 elements |
| Logic Array Blocks | — | 963 LABs |
| Maximum Frequency | — | 437.5 MHz |
| Number of I/Os | — | 346 I/Os |
| Package Type | — | 484-pin FBGA |
| Número de pines | — | 484 pins |
| Programmability | — | User-programmable FPGA |
| I/O Type | — | [DATA_NEEDED: supported I/O standards] |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |
| Standard Package Quantity | — | [DATA_NEEDED: standard package quantity] |