EP3C16F484C7 vs EP3C16F484C6N Comparison

Detailed side-by-side comparison of EP3C16F484C7 by Intel and EP3C16F484C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F484C7 EP3C16F484C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type FPGA —
FPGA Family Cyclone III —
Logic Elements 15,408 elements —
Logic Array Blocks 963 LABs —
Maximum Frequency 437.5 MHz —
Number of I/Os 346 I/Os —
Process Technology 65 nm CMOS 65 nm TSMC
Core Supply Voltage 1.2 V 1.15 V to 1.25 V
Package Type 484-pin FBGA —
Mounting Type Surface mount Surface Mount
Number of Pins 484 pins —
Programmability User-programmable FPGA —
I/O Type [DATA_NEEDED: supported I/O standards] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] 516,096 bits (504 Kbits)
PLL Count [DATA_NEEDED: PLL count] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
RoHS Status unknown Compliant (lead-free, N suffix)
REACH Status unknown —
AEC-Q100 Qualification not_applicable —
Standard Package Quantity [DATA_NEEDED: standard package quantity] —
Series — Cyclone III
Family — Cyclone III
Logic Elements (LE) — 15,408
Adaptive Logic Modules (ALMs) — 963 ALMs
Embedded 18x18 Multipliers — 56
User I/O Pins (max) — 346
PLLs — 4
Global Clock Networks — 20
Operating Temperature (Commercial) — 0 C to 85 C
Speed Grade — -6
Package — 484-ball FineLine BGA (FBGA)
Ball Pitch — 1.0 mm
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel

Datasheets & Resources

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