EP3C16F484C7 vs EP3C16F484C7N Comparison

Detailed side-by-side comparison of EP3C16F484C7 by Intel and EP3C16F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F484C7 EP3C16F484C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type FPGA —
FPGA Family Cyclone III —
Logic Elements 15,408 elements 15,408
Logic Array Blocks 963 LABs —
Maximum Frequency 437.5 MHz —
Number of I/Os 346 I/Os —
Process Technology 65 nm CMOS 65 nm TSMC low-power
Core Supply Voltage 1.2 V —
Package Type 484-pin FBGA —
Mounting Type Surface mount —
Number of Pins 484 pins —
Programmability User-programmable FPGA —
I/O Type [DATA_NEEDED: supported I/O standards] —
Embedded Memory [DATA_NEEDED: embedded memory capacity] 504 Kbits (M9K blocks)
PLL Count [DATA_NEEDED: PLL count] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
RoHS Status unknown Compliant
REACH Status unknown —
AEC-Q100 Qualification not_applicable —
Standard Package Quantity [DATA_NEEDED: standard package quantity] —
Device Family — Cyclone III
Embedded Multipliers — 56 (18x18)
PLLs — 4
User I/O Pins — 346
Core Voltage — 1.2 V (1.15 V to 1.25 V)
Package — 484-ball FBGA
Speed Grade — -7
Operating Temperature — 0C to +85C (commercial)
Maximum Internal Frequency — 437.5 MHz
I/O Standards Supported — LVDS, LVCMOS, LVTTL, SSTL, HSTL
Configuration Method — JTAG (IEEE 1149.1), EPCS serial flash, Active Serial

Datasheets & Resources

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