EP3C16F484C7N vs EP3C25F324C7N Comparison

Detailed side-by-side comparison of EP3C16F484C7N by Intel and EP3C25F324C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3C25F324C7N EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N βœ“ Active

Specification Comparison

Parameter EP3C16F484C7N EP3C25F324C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $30.10 $0.00
Device Family Cyclone III Cyclone III
Logic Elements 15,408 β€”
Embedded Memory 504 Kbits (M9K blocks) 608,256 bits
Embedded Multipliers 56 (18x18) β€”
PLLs 4 β€”
User I/O Pins 346 β€”
Process Technology 65 nm TSMC low-power 65 nm
Core Voltage 1.2 V (1.15 V to 1.25 V) 1.2 V
Package 484-ball FBGA 324-ball FBGA
Speed Grade -7 β€”
Operating Temperature 0C to +85C (commercial) β€”
Maximum Internal Frequency 437.5 MHz β€”
I/O Standards Supported LVDS, LVCMOS, LVTTL, SSTL, HSTL β€”
Configuration Method JTAG (IEEE 1149.1), EPCS serial flash, Active Serial β€”
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Product Type β€” Field Programmable Gate Array (FPGA)
Logic Cells β€” 24,624 cells
Available I/O Pins β€” 215 I/O
Maximum Listed Frequency β€” 437.5 MHz
Terminal Count β€” 324 terminals
Terminal Form β€” Ball
Package Code β€” BGA
Package Shape β€” Rectangular
Mounting Type β€” Surface Mount
Temperature Grading β€” Other
Programmability β€” Field programmable
REACH Status β€” [DATA_NEEDED: REACH status]
AEC-Q100 Qualification β€” [DATA_NEEDED: AEC-Q100 qualification]

Datasheets & Resources

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