EP3C16F484C7N vs EP3C25F324C7N Perbandingan
Perbandingan bersamaan detil EP3C16F484C7N dari Intel dan EP3C25F324C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C16F484C7N | EP3C25F324C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | Cyclone III | Cyclone III |
| Logic Elements | 15,408 | — |
| Embedded Memory | 504 Kbits (M9K blocks) | 608,256 bits |
| Embedded Multipliers | 56 (18x18) | — |
| PLLs | 4 | — |
| User I/O Pins | 346 | — |
| Process Technology | 65 nm TSMC low-power | 65 nm |
| Core Voltage | 1.2 V (1.15 V to 1.25 V) | 1.2 V |
| Paket | 484-ball FBGA | 324-ball FBGA |
| Speed Grade | -7 | — |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Maximum Internal Frequency | 437.5 MHz | — |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL | — |
| Configuration Method | JTAG (IEEE 1149.1), EPCS serial flash, Active Serial | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 24,624 cells |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Tipe Mounting | — | Surface Mount |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |