EP3C16U256C7 vs EP3C16F256I7N Comparison

Detailed side-by-side comparison of EP3C16U256C7 by Intel and EP3C16F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16U256C7 EP3C16F256I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Cyclone III Field Programmable Gate Array (FPGA) —
Logic Elements 15,408 —
Embedded RAM 516,096 bits —
User I/O Count 168 —
Package 256-LFBGA 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Technology 65 nm —
Core Supply Voltage 1.2 V —
Maximum Clock Frequency 437.5 MHz —
Manufacturer Intel/Altera —
Series Cyclone III —
Mounting Type Surface Mount —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
I/O Standard Options [DATA_NEEDED: supported I/O standards] —
Number of PLLs [DATA_NEEDED: PLL count] —
Configuration Scheme [DATA_NEEDED: supported configuration schemes] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] Compliant
REACH Compliance [DATA_NEEDED: REACH compliance] —
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded Memory — 56 M9K blocks (504 Kbit)
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
Operating Temperature — -40C to +100C (industrial, I7)
Supply Voltage (Core) — 1.2 V typical
Process Technology — TSMC 60 nm low-leakage
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)

Datasheets & Resources

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