EP3C16U256C7 vs EP3C16F256I7N Vergleich
Detaillierter Direktvergleich von EP3C16U256C7 von Intel und EP3C16F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16U256C7 | EP3C16F256I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | — |
| Logic Elements | 15,408 | — |
| Embedded RAM | 516,096 bits | — |
| User I/O Count | 168 | — |
| Gehäuse | 256-LFBGA | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Maximale Taktfrequenz | 437.5 MHz | — |
| Manufacturer | Intel/Altera | — |
| Series | Cyclone III | — |
| Montageart | Surface Mount | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| I/O Standard Options | [DATA_NEEDED: supported I/O standards] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Configuration Scheme | [DATA_NEEDED: supported configuration schemes] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | Compliant |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| Automotive Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded Memory | — | 56 M9K blocks (504 Kbit) |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 168 |
| Betriebstemperatur | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Process Technology | — | TSMC 60 nm low-leakage |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |