EP3C16U256I7 vs EP3C16F256I7N Comparison
Detailed side-by-side comparison of EP3C16U256I7 by Altera and EP3C16F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C16U256I7 | EP3C16F256I7N |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | — |
| Logic Elements | 16,320 | — |
| RAM Bits | 516,096 bits | — |
| Number of I/O | 168 | — |
| Package | 256-LFBGA | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Number of Terminals | 256 balls | — |
| Mounting Type | Surface Mount | — |
| Temperature Grade | Industrial | — |
| Form of Terminal | Ball | — |
| Package Shape | Rectangular | — |
| Manufacturer | Altera | — |
| Series | Cyclone III | — |
| Logic Family | FPGA | — |
| Programmable I/O Count | 168 | — |
| Configuration Memory | [DATA_NEEDED: configuration memory capacity] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Number of Embedded Memory Blocks | [DATA_NEEDED: embedded memory block count] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| Maximum Clock Frequency | [DATA_NEEDED: maximum clock frequency] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded Memory | — | 56 M9K blocks (504 Kbit) |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 168 |
| Operating Temperature | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Process Technology | — | TSMC 60 nm low-leakage |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |