EP3C16U256I7 vs EP3C16F256I7N Vergleich
Detaillierter Direktvergleich von EP3C16U256I7 von Altera und EP3C16F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16U256I7 | EP3C16F256I7N |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | — |
| Logic Elements | 16,320 | — |
| RAM Bits | 516,096 bits | — |
| Number of I/O | 168 | — |
| Gehäuse | 256-LFBGA | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Number of Terminals | 256 balls | — |
| Montageart | Surface Mount | — |
| Temperature Grade | Industrial | — |
| Form of Terminal | Ball | — |
| Package Shape | Rectangular | — |
| Manufacturer | Altera | — |
| Series | Cyclone III | — |
| Logic Family | FPGA | — |
| Programmable I/O Count | 168 | — |
| Configuration Memory | [DATA_NEEDED: configuration memory capacity] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Number of Embedded Memory Blocks | [DATA_NEEDED: embedded memory block count] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| Maximale Taktfrequenz | [DATA_NEEDED: maximum clock frequency] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded Memory | — | 56 M9K blocks (504 Kbit) |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 168 |
| Betriebstemperatur | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Process Technology | — | TSMC 60 nm low-leakage |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |