EP3C16U256I7 vs EP3C16F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C16U256I7 disebabkan oleh Altera dan EP3C16F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C16U256I7 | EP3C16F256I7N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | — |
| Logic Elements | 16,320 | — |
| RAM Bits | 516,096 bits | — |
| Number of I/O | 168 | — |
| Kemasan | 256-LFBGA | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Number of Terminals | 256 balls | — |
| Jenis Pemasangan | Surface Mount | — |
| Temperature Grade | Industrial | — |
| Form of Terminal | Ball | — |
| Package Shape | Rectangular | — |
| Manufacturer | Altera | — |
| Series | Cyclone III | — |
| Logic Family | FPGA | — |
| Programmable I/O Count | 168 | — |
| Configuration Memory | [DATA_NEEDED: configuration memory capacity] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Number of Embedded Memory Blocks | [DATA_NEEDED: embedded memory block count] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| Frekuensi Klock Maksimum | [DATA_NEEDED: maximum clock frequency] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded Memory | — | 56 M9K blocks (504 Kbit) |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 168 |
| Suhu Operasi | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Process Technology | — | TSMC 60 nm low-leakage |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |