EP3C25F256I7N vs EP3C5F256I7N Comparison
Detailed side-by-side comparison of EP3C25F256I7N by Intel and EP3C5F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F256I7N | EP3C5F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | FPGA | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 24,624 | 5,136 |
| Embedded Memory | 608,256 bits | — |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Package | 256-FBGA (FineLine BGA) | 256-FBGA (FineLine BGA) |
| Operating Temperature | -40C to +125C | -40C to +125C (Industrial) |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | TSMC 65nm low-power |
| PLLs | 4 general-purpose PLLs | 2 |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free) | Compliant |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Total Memory Bits | — | 423,936 bits |
| Embedded Multipliers (18x18) | — | 26 |
| Maximum User I/Os | — | 182 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG, FPP |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| MSL Level | — | 3 (168 hours) |