EP3C25F256I7N vs EP3C5F256I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F256I7N sa pamamagitan ng Intel at EP3C5F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F256I7N | EP3C5F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | FPGA | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 24,624 | 5,136 |
| Embedded Memory | 608,256 bits | — |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Packhaging | 256-FBGA (FineLine BGA) | 256-FBGA (FineLine BGA) |
| Temperature na Operasyon | -40C to +125C | -40C to +125C (Industrial) |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | TSMC 65nm low-power |
| PLLs | 4 general-purpose PLLs | 2 |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Total Memory Bits | — | 423,936 bits |
| Embedded Multipliers (18x18) | — | 26 |
| Maximum User I/Os | — | 182 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG, FPP |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Level ng MSL | — | 3 (168 hours) |