EP3C25F324C6N vs EP3C55U484C6N Comparison

Detailed side-by-side comparison of EP3C25F324C6N by Intel and EP3C55U484C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324C6N EP3C55U484C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $62.30 $274.06
Series Cyclone III β€”
Family Cyclone III (low-power, low-cost FPGA) Cyclone III
Logic Elements (LE) 24,624 β€”
Total Memory Bits 608,256 bits β€”
Embedded Memory Blocks M9K blocks, 66 total β€”
Embedded Multipliers 66 (18x18) β€”
DSP Blocks 66 dedicated 18x18 multipliers β€”
User I/O Pins 215 β€”
Number of I/O Banks 8 β€”
PLLs 4 general-purpose PLLs β€”
Package 324-BGA (FBGA-324), fine-pitch 484-FBGA
Speed Grade C6 (commercial) β€”
Operating Temperature 0C to +85C (commercial) [DATA_NEEDED: operating temperature range]
Process Technology TSMC 65 nm low-power (LP) 65 nm
Configuration Schemes Passive Serial, Fast Passive Parallel, JTAG β€”
Lead-Free / RoHS Yes (lead-free, RoHS compliant) β€”
Mounting Type Surface Mount Surface Mount
Product Type β€” Field Programmable Gate Array (FPGA)
Logic Elements β€” 55856 LE
Number of Logic Cells β€” 55856 cells
Embedded Memory β€” 2396160 bit
I/O Count β€” 327 I/O
Core Technology Voltage β€” 1.2 V
JTAG LVTTL/LVCMOS Operation β€” 3.3 V, 3.0 V, 2.5 V
Package Code β€” FBGA
Terminal Count β€” 484
Terminal Form β€” Ball
Clock Rate β€” 437.5 MHz
RoHS Status β€” Compliant
REACH Status β€” unknown
Automotive Qualification β€” unknown
Lead-Free Status β€” unknown
Configuration Interface β€” [DATA_NEEDED: configuration interface]
Maximum I/O Voltage β€” [DATA_NEEDED: maximum I/O voltage]
Thermal Resistance β€” [DATA_NEEDED: junction-to-ambient thermal resistance]

Datasheets & Resources

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