EP3C25F324C6N vs EP3C55U484C6N 比較

詳細並排比較 EP3C25F324C6N 由 Intel 與 EP3C55U484C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C25F324C6N EP3C55U484C6N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series Cyclone III —
Family Cyclone III (low-power, low-cost FPGA) Cyclone III
Logic Elements (LE) 24,624 —
Total Memory Bits 608,256 bits —
Embedded Memory Blocks M9K blocks, 66 total —
Embedded Multipliers 66 (18x18) —
DSP Blocks 66 dedicated 18x18 multipliers —
User I/O Pins 215 —
Number of I/O Banks 8 —
PLLs 4 general-purpose PLLs —
封裝 324-BGA (FBGA-324), fine-pitch 484-FBGA
Speed Grade C6 (commercial) —
工作溫度 0C to +85C (commercial) [DATA_NEEDED: operating temperature range]
Process Technology TSMC 65 nm low-power (LP) 65 nm
Configuration Schemes Passive Serial, Fast Passive Parallel, JTAG —
Lead-Free / RoHS Yes (lead-free, RoHS compliant) —
安裝類型 Surface Mount Surface Mount
Product Type — Field Programmable Gate Array (FPGA)
Logic Elements — 55856 LE
Number of Logic Cells — 55856 cells
Embedded Memory — 2396160 bit
I/O Count — 327 I/O
Core Technology Voltage — 1.2 V
JTAG LVTTL/LVCMOS Operation — 3.3 V, 3.0 V, 2.5 V
Package Code — FBGA
Terminal Count — 484
Terminal Form — Ball
Clock Rate — 437.5 MHz
RoHS 狀態 — Compliant
REACH Status — unknown
Automotive Qualification — unknown
Lead-Free Status — unknown
Configuration Interface — [DATA_NEEDED: configuration interface]
Maximum I/O Voltage — [DATA_NEEDED: maximum I/O voltage]
熱阻 — [DATA_NEEDED: junction-to-ambient thermal resistance]

資料表與資源

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