EP3C25F324C6N vs EP3C55U484C6N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C6N disebabkan oleh Intel dan EP3C55U484C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C25F324C6N EP3C55U484C6N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Cyclone III —
Family Cyclone III (low-power, low-cost FPGA) Cyclone III
Logic Elements (LE) 24,624 —
Total Memory Bits 608,256 bits —
Embedded Memory Blocks M9K blocks, 66 total —
Embedded Multipliers 66 (18x18) —
DSP Blocks 66 dedicated 18x18 multipliers —
User I/O Pins 215 —
Number of I/O Banks 8 —
PLLs 4 general-purpose PLLs —
Kemasan 324-BGA (FBGA-324), fine-pitch 484-FBGA
Speed Grade C6 (commercial) —
Suhu Operasi 0C to +85C (commercial) [DATA_NEEDED: operating temperature range]
Process Technology TSMC 65 nm low-power (LP) 65 nm
Configuration Schemes Passive Serial, Fast Passive Parallel, JTAG —
Lead-Free / RoHS Yes (lead-free, RoHS compliant) —
Jenis Pemasangan Surface Mount Surface Mount
Product Type — Field Programmable Gate Array (FPGA)
Logic Elements — 55856 LE
Number of Logic Cells — 55856 cells
Embedded Memory — 2396160 bit
I/O Count — 327 I/O
Core Technology Voltage — 1.2 V
JTAG LVTTL/LVCMOS Operation — 3.3 V, 3.0 V, 2.5 V
Package Code — FBGA
Terminal Count — 484
Terminal Form — Ball
Clock Rate — 437.5 MHz
Status RoHS — Compliant
REACH Status — unknown
Automotive Qualification — unknown
Lead-Free Status — unknown
Configuration Interface — [DATA_NEEDED: configuration interface]
Maximum I/O Voltage — [DATA_NEEDED: maximum I/O voltage]
Tegangan Panas — [DATA_NEEDED: junction-to-ambient thermal resistance]

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga