EP3C25F324C7N vs EP3C25F324I7N Comparison
Detailed side-by-side comparison of EP3C25F324C7N by Intel and EP3C25F324I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C7N | EP3C25F324I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $58.20 |
| Product Type | Field Programmable Gate Array (FPGA) | β |
| Device Family | Cyclone III | β |
| Logic Cells | 24,624 cells | β |
| Embedded Memory | 608,256 bits | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Available I/O Pins | 215 I/O | β |
| Maximum Listed Frequency | 437.5 MHz | β |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Package | 324-ball FBGA | 324-ball FBGA (Fine-Pitch BGA) |
| Terminal Count | 324 terminals | β |
| Terminal Form | Ball | β |
| Package Code | BGA | β |
| Package Shape | Rectangular | β |
| Mounting Type | Surface Mount | β |
| Temperature Grading | Other | β |
| Programmability | Field programmable | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | β |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | β |
| Family | β | Cyclone III |
| Logic Elements (LEs) | β | 24,624 |
| Embedded 18x18 Multipliers | β | 66 |
| Maximum User I/O Pins | β | 215 |
| LVDS Pairs | β | 66 |
| PLLs | β | 4 |
| Global Clock Networks | β | 20 |
| I/O Bank Voltage Range | β | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Operating Temperature | β | -40C to +100C (Industrial) |
| Configuration Modes | β | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Speed Grade | β | 7 (slower speed grade, lower power) |
| Lead-Free | β | Yes |
| MSL Level | β | 3 (168 hours) |