EP3C25F324C7N vs EP3C25F324I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C7N sa pamamagitan ng Intel at EP3C25F324I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C7N | EP3C25F324I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Packhaging | 324-ball FBGA | 324-ball FBGA (Fine-Pitch BGA) |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Speed Grade | — | 7 (slower speed grade, lower power) |
| Lead-Free | — | Yes |
| Level ng MSL | — | 3 (168 hours) |