EP3C25F324C8 vs EP3C25F256I7N Comparison
Detailed side-by-side comparison of EP3C25F324C8 by Intel and EP3C25F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C8 | EP3C25F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Active |
| Series | Cyclone III | — |
| Logic Elements | 24,624 LE | 24,624 |
| Logic Array Blocks | 1,539 LABs | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18 x 18) | 66 (18x18) |
| User I/Os | 215 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Process Technology | 65 nm CMOS, SRAM-based | 65 nm low-power |
| Core Voltage | 1.2 V | — |
| Speed Grade | 8 (commercial) | 7 |
| Operating Temperature | 0 °C to +85 °C (commercial) | -40C to +125C |
| Package | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 256-FBGA (FineLine BGA) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Maximum Internal Clock | 402 MHz | — |
| RoHS Status | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | Compliant (lead-free) |
| Device Type | — | FPGA |
| Family | — | Cyclone III |
| Maximum User I/O | — | 156 |
| Core Supply Voltage | — | 1.2 V |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Hot Socketing | — | Supported |
| Configuration | — | SRAM-based, in-system programmable |