EP3C25F324C8 vs EP3C25F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C8 disebabkan oleh Intel dan EP3C25F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324C8 | EP3C25F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone III | — |
| Logic Elements | 24,624 LE | 24,624 |
| Logic Array Blocks | 1,539 LABs | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18 x 18) | 66 (18x18) |
| User I/Os | 215 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Process Technology | 65 nm CMOS, SRAM-based | 65 nm low-power |
| Core Voltage | 1.2 V | — |
| Speed Grade | 8 (commercial) | 7 |
| Suhu Operasi | 0 °C to +85 °C (commercial) | -40C to +125C |
| Kemasan | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 256-FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Maximum Internal Clock | 402 MHz | — |
| Status RoHS | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | Compliant (lead-free) |
| Device Type | — | FPGA |
| Family | — | Cyclone III |
| Maximum User I/O | — | 156 |
| Core Supply Voltage | — | 1.2 V |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Hot Socketing | — | Supported |
| Configuration | — | SRAM-based, in-system programmable |