EP3C25F324C8N vs EP3C25F324C7 Comparison
Detailed side-by-side comparison of EP3C25F324C8N by Intel and EP3C25F324C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C8N | EP3C25F324C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone III | — |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | 215 |
| Package | 324-BGA (FineLine) | — |
| Supply Voltage - Core | 1.2 V | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0 C to +85 C (commercial, suffix C) | — |
| Speed Grade | 8 | — |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| RoHS Status | Compliant | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Memory Bits | — | 608,256 bits |
| Package Type | — | 324-BGA |
| Package Code | — | BGA |
| Number of Terminals | — | 324 |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Operating Voltage Range | — | [DATA_NEEDED: operating voltage range] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| Internal Memory Configuration | — | [DATA_NEEDED: internal memory configuration] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |