EP3C25F324C8N vs EP3C25F324C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C8N disebabkan oleh Intel dan EP3C25F324C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324C8N | EP3C25F324C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | — |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | 215 |
| Kemasan | 324-BGA (FineLine) | — |
| Supply Voltage - Core | 1.2 V | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0 C to +85 C (commercial, suffix C) | — |
| Speed Grade | 8 | — |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Status RoHS | Compliant | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Memory Bits | — | 608,256 bits |
| Package Type | — | 324-BGA |
| Package Code | — | BGA |
| Number of Terminals | — | 324 |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Operating Voltage Range | — | [DATA_NEEDED: operating voltage range] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Internal Memory Configuration | — | [DATA_NEEDED: internal memory configuration] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |