EP3C25F324C8N vs EP3C25F324C7 Vergleich
Detaillierter Direktvergleich von EP3C25F324C8N von Intel und EP3C25F324C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324C8N | EP3C25F324C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Family | Cyclone III | — |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | 215 |
| Gehäuse | 324-BGA (FineLine) | — |
| Supply Voltage - Core | 1.2 V | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 C to +85 C (commercial, suffix C) | — |
| Speed Grade | 8 | — |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| RoHS-Status | Compliant | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Memory Bits | — | 608,256 bits |
| Package Type | — | 324-BGA |
| Package Code | — | BGA |
| Number of Terminals | — | 324 |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Operating Voltage Range | — | [DATA_NEEDED: operating voltage range] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Internal Memory Configuration | — | [DATA_NEEDED: internal memory configuration] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |