EP3C25F324I7 vs EP3C25F324C7N Comparison
Detailed side-by-side comparison of EP3C25F324I7 by Intel and EP3C25F324C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324I7 | EP3C25F324C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $64.80 | $0.00 |
| Series | Cyclone III | β |
| Logic Elements (LEs) | 24,624 | β |
| Logic Array Blocks (LABs) | 1,539 | β |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | 608,256 bits |
| Embedded 18x18 Multipliers | 66 | β |
| PLLs | 4 | β |
| Global Clock Networks | 20 | β |
| Maximum User I/O | 215 | β |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | β |
| Operating Junction Temperature | -40 Β°C to +100 Β°C (industrial) | β |
| Package | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | β |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Product Type | β | Field Programmable Gate Array (FPGA) |
| Device Family | β | Cyclone III |
| Logic Cells | β | 24,624 cells |
| Available I/O Pins | β | 215 I/O |
| Maximum Listed Frequency | β | 437.5 MHz |
| Core Voltage | β | 1.2 V |
| Terminal Count | β | 324 terminals |
| Terminal Form | β | Ball |
| Package Code | β | BGA |
| Package Shape | β | Rectangular |
| Temperature Grading | β | Other |
| Programmability | β | Field programmable |
| REACH Status | β | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | β | [DATA_NEEDED: AEC-Q100 qualification] |