EP3C25F324I7 vs EP3C25F324C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324I7 disebabkan oleh Intel dan EP3C25F324C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324I7 | EP3C25F324C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | 608,256 bits |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Suhu Hubungan Operasi | -40 °C to +100 °C (industrial) | — |
| Kemasan | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Core Voltage | — | 1.2 V |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |