EP3C40F780C8N vs EP3C120F780C8N Comparison

Detailed side-by-side comparison of EP3C40F780C8N by Intel and EP3C120F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C40F780C8N EP3C120F780C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Cyclone® III —
Family Cyclone III Cyclone III
Logic Elements (LE) 39,600 —
Total Memory Bits 1,161,216 bits —
Number of LABs/CLBs 2,475 —
Embedded Memory Blocks M9K x 126 —
Embedded 18x18 Multipliers 126 (up to 396 9x9) —
Number of PLLs 4 —
Maximum User I/Os 535 —
Number of I/O Banks 9 —
Core Voltage 1.15V to 1.25V —
Operating Temperature 0°C to +85°C (Commercial) [DATA_NEEDED: operating temperature range]
Speed Grade 8 (C8) —
Package 780-ball FBGA, 1.0mm pitch —
Mounting Type Surface Mount (BGA) Surface Mount
Process Technology 65nm TSMC low-power —
Configuration Modes AS, PS, FPP, JTAG —
RoHS Status Compliant —
Device Type — Field Programmable Gate Array (FPGA)
Logic Elements — 119088
User I/O Count — 531
Embedded Memory — 3981312 bit
Operating Supply Voltage — 1.2 V
Maximum Internal Frequency — 402 MHz
Alternate Listed Internal Frequency — 472 MHz
Package Type — FBGA-780
Package Dimensions — 23 mm x 23 mm
Package Height — 2.60 mm
Ball Pitch — 1 mm
Ordering Status — Buy now, ships today
Compliance — [DATA_NEEDED: compliance and environmental certifications]
Configuration Memory Type — [DATA_NEEDED: configuration memory technology]

Datasheets & Resources

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