EP3C40F780C8N vs EP3C120F780C8N Vergleich
Detaillierter Direktvergleich von EP3C40F780C8N von Intel und EP3C120F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C8N | EP3C120F780C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $64,85 | $0,00 |
| Series | Cyclone® III | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | — |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | — |
| Number of PLLs | 4 | — |
| Maximum User I/Os | 535 | — |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | — |
| Betriebstemperatur | 0°C to +85°C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | 8 (C8) | — |
| Gehäuse | 780-ball FBGA, 1.0mm pitch | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Process Technology | 65nm TSMC low-power | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements | — | 119088 |
| User I/O Count | — | 531 |
| Embedded Memory | — | 3981312 bit |
| Betriebsversorgungsspannung | — | 1.2 V |
| Maximum Internal Frequency | — | 402 MHz |
| Alternate Listed Internal Frequency | — | 472 MHz |
| Package Type | — | FBGA-780 |
| Package Dimensions | — | 23 mm x 23 mm |
| Package Height | — | 2.60 mm |
| Ball Pitch | — | 1 mm |
| Ordering Status | — | Buy now, ships today |
| Compliance | — | [DATA_NEEDED: compliance and environmental certifications] |
| Configuration Memory Type | — | [DATA_NEEDED: configuration memory technology] |