EP3C55F484I7 vs EP3C40F484I7N Comparison
Detailed side-by-side comparison of EP3C55F484I7 by Intel and EP3C40F484I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C55F484I7 | EP3C40F484I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | 1,161,216 |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Temperature | -40 °C to +100 °C (Industrial grade, I-suffix) | -40 °C to +125 °C (Industrial) |
| Package | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball FBGA, 1.0 mm pitch (F484) |
| Mounting Type | Surface Mount (BGA) | — |
| RoHS Status | Lead-Free, RoHS Compliant | Compliant |
| MSL Level | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | TSMC 65 nm low-power |
| Family | — | Cyclone® III |
| Logic Elements (LE) | — | 39,600 |
| Logic Array Blocks (LAB) | — | 2,475 |
| Embedded Multipliers (18x18) | — | 126 |
| User I/O Pins | — | 331 |
| I/O Banks | — | 8 |
| Speed Grade | — | 7 (fast) |
| Configuration | — | AS / AP / PS / FPP / JTAG |