EP3C55F484I7 vs EP3C40F484I7N Perbandingan
Perbandingan bersamaan detil EP3C55F484I7 dari Intel dan EP3C40F484I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F484I7 | EP3C40F484I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | 1,161,216 |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | 1.2 V |
| Suhu Kerja | -40 °C to +100 °C (Industrial grade, I-suffix) | -40 °C to +125 °C (Industrial) |
| Paket | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball FBGA, 1.0 mm pitch (F484) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Status RoHS | Lead-Free, RoHS Compliant | Compliant |
| Level MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | TSMC 65 nm low-power |
| Family | — | Cyclone® III |
| Logic Elements (LE) | — | 39,600 |
| Logic Array Blocks (LAB) | — | 2,475 |
| Embedded Multipliers (18x18) | — | 126 |
| User I/O Pins | — | 331 |
| I/O Banks | — | 8 |
| Speed Grade | — | 7 (fast) |
| Configuration | — | AS / AP / PS / FPP / JTAG |