EP3C5F256C6 vs EP3C5F256C8N Comparison
Detailed side-by-side comparison of EP3C5F256C6 by Intel and EP3C5F256C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256C6 | EP3C5F256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone III | — |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.15 V to 1.25 V |
| Process Technology | 65 nm CMOS, low-k | 65 nm |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Package | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| RoHS Status | Compliant (lead-free per FBGA package) | Lead Free (per Altera/Intel product page) |
| Series | — | Cyclone III |
| Device Family | — | Cyclone III (EP3C5) |
| Logic Elements (LEs) | — | 5,136 |
| Embedded Memory (bits) | — | 423,936 |
| Embedded Memory (Kbits) | — | 414 Kbits |
| Maximum User I/Os | — | 182 |
| Operating Temperature | — | 0C to 85C (Commercial) |
| Configuration Memory | — | SRAM-based (in-system reprogrammable) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |