EP3C5F256C6 vs EP3C5F256C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256C6 sa pamamagitan ng Intel at EP3C5F256C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256C6 | EP3C5F256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | — |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.15 V to 1.25 V |
| Process Technology | 65 nm CMOS, low-k | 65 nm |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Packhaging | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| Tindminan RoHS | Compliant (lead-free per FBGA package) | Lead Free (per Altera/Intel product page) |
| Series | — | Cyclone III |
| Device Family | — | Cyclone III (EP3C5) |
| Logic Elements (LEs) | — | 5,136 |
| Embedded Memory (bits) | — | 423,936 |
| Embedded Memory (Kbits) | — | 414 Kbits |
| Maximum User I/Os | — | 182 |
| Temperature na Operasyon | — | 0C to 85C (Commercial) |
| Configuration Memory | — | SRAM-based (in-system reprogrammable) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |