EP3C5F256C6 vs EP3C5F256C8N Comparación
Comparación detallada lado a lado de EP3C5F256C6 por Intel y EP3C5F256C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5F256C6 | EP3C5F256C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $10,95 |
| Family | Cyclone III | — |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.15 V to 1.25 V |
| Process Technology | 65 nm CMOS, low-k | 65 nm |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Encapsulado | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| Estado RoHS | Compliant (lead-free per FBGA package) | Lead Free (per Altera/Intel product page) |
| Series | — | Cyclone III |
| Device Family | — | Cyclone III (EP3C5) |
| Logic Elements (LEs) | — | 5,136 |
| Embedded Memory (bits) | — | 423,936 |
| Embedded Memory (Kbits) | — | 414 Kbits |
| Maximum User I/Os | — | 182 |
| Temperatura de funcionamiento | — | 0C to 85C (Commercial) |
| Configuration Memory | — | SRAM-based (in-system reprogrammable) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |