EP3SE110F780C2 vs EP3SE110F780C3N Comparison
Detailed side-by-side comparison of EP3SE110F780C2 by Intel and EP3SE110F780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE110F780C2 | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4,350.00 | $1,245.00 |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Series | EP3SE110 | β |
| Logic Elements (LE) | 107,500 | β |
| Embedded Memory | 8,936,448 bits (8.93 Mbit) | TriMatrix (MLAB + M9K + M144K) |
| Maximum User I/O | 488 | β |
| Embedded Multipliers | 768 (18x18) | β |
| PLLs | 4 | β |
| Process Node | 65 nm | β |
| Core Voltage (VCCINT) | 1.1 V | β |
| Package | 780-BBGA, FCBGA (FineLine) | 780-ball FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (Commercial) | β |
| Speed Grade | C2 | β |
| RoHS Status | Compliant | Compliant |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | β |
| Logic Elements (LEs) | β | 107,500 |
| Embedded Memory Bits | β | 8,936,448 |
| Logic Array Blocks (LABs) | β | 4,300 |
| User I/Os | β | 488 |
| Core Voltage | β | 1.1 V |
| Process Technology | β | 65 nm |
| Maximum Operating Frequency | β | 500 MHz |
| DSP Blocks | β | Yes (integrated, count varies by configuration) |
| Transceiver Channels | β | 8 (multi-gigabit) |
| Configuration Method | β | Serial / Parallel via Quartus II |
| Operating Temperature Grade | β | Commercial (C suffix) |
| MSL Level | β | [DATA_NEEDED: MSL rating] |