EP3SE110F780C2 vs EP3SE110F780C3N Perbandingan
Perbandingan bersamaan detil EP3SE110F780C2 dari Intel dan EP3SE110F780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE110F780C2 | EP3SE110F780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Series | EP3SE110 | — |
| Logic Elements (LE) | 107,500 | — |
| Embedded Memory | 8,936,448 bits (8.93 Mbit) | TriMatrix (MLAB + M9K + M144K) |
| Maximum User I/O | 488 | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLLs | 4 | — |
| Process Node | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Paket | 780-BBGA, FCBGA (FineLine) | 780-ball FCBGA (Flip-Chip BGA) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | 0C to +85C (Commercial) | — |
| Speed Grade | C2 | — |
| Status RoHS | Compliant | Compliant |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Logic Array Blocks (LABs) | — | 4,300 |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Maximum Operating Frequency | — | 500 MHz |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Level MSL | — | [DATA_NEEDED: MSL rating] |