EP3SE110F780C4L vs EP3SE110F780C3N Comparison
Detailed side-by-side comparison of EP3SE110F780C4L by Intel and EP3SE110F780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE110F780C4L | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,550.00 | $1,245.00 |
| Series | Stratix III E | β |
| Number of Logic Elements (LE) | 107,500 | β |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | β |
| Total Memory Bits | 8,936,448 bits | β |
| Number of 18x18 Multipliers | 488 | β |
| Number of PLLs | [DATA_NEEDED: PLL count] | β |
| User I/O Pins | 488 | β |
| Speed Grade | -4 (commercial) | β |
| Process Variant | L (low-leakage) | β |
| Operating Temperature | 0C to +85C (commercial) | β |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | β |
| Package Type | 780-Ball FCBGA | β |
| Ball Pitch | 1.0 mm | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Process Technology | 65 nm CMOS | 65 nm |
| RoHS Status | Compliant | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating] |
| Family | β | Stratix III E |
| Logic Elements (LEs) | β | 107,500 |
| Embedded Memory Bits | β | 8,936,448 |
| Logic Array Blocks (LABs) | β | 4,300 |
| User I/Os | β | 488 |
| Package | β | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | β | 1.1 V |
| Maximum Operating Frequency | β | 500 MHz |
| DSP Blocks | β | Yes (integrated, count varies by configuration) |
| Transceiver Channels | β | 8 (multi-gigabit) |
| Embedded Memory | β | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | β | Serial / Parallel via Quartus II |
| Operating Temperature Grade | β | Commercial (C suffix) |